Meta Brain TS860G7 6U Rack Server
Classification:
The TS860G7 is an eight-way server powered by the fourth-generation Intel ® Xeon ® scalable processor (Sapphire Rapids), providing ultra-high computing performance and comprehensive reliability for customers' business-critical applications, suitable for large transaction databases, SAP HANA, ERP, virtualization and other scenarios.
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Features
Ultimate computing and exceptional performance
Based on the fourth-generation Intel® Xeon® scalable processor, the TS860G7 supports up to 60 cores and 120 threads per CPU, and the TDP can reach up to 350W. A single CPU is equipped with four groups of 16GT/s high-speed UPI links, providing ultra-high-speed interconnection for eight cpus and high-speed computing experience for customers.
Supports 128 DDR5 RDIMMs /3DS RDIMMs, 4800MT/s for 1DPC, and 4400MT/s for 2DPC, suitable for scenarios that require memory capacity, such as memory database applications and big data analysis.
Supports a maximum of four dual-width Gpus or eight single-width Gpus for heterogeneous computing, and is suitable for machine learning, deep learning, and virtualization applications.
Excellent I/O balance design, comprehensively improve data access speed and processing efficiency, greatly improve the overall data throughput of the system, suitable for fast data transmission and large-scale processing scenarios.
High stability, reliability, and security
Compared to the previous generation design, the whole system is fully modular design, and the RAS feature is improved by 50%, which is very suitable for business-critical applications with high reliability requirements.
Multiple power supply protection measures, N+M redundant power supply, and dynamic power capping technology ensure uninterrupted system operation when the power supply in the equipment room or power supply is abnormal.
PFR startup security, firmware tamper-proof, BIOS/BMC dual redundancy design to ensure stable and secure system operation.
Memory MRT technology and memory funnel mechanism improve memory module reliability and fault tolerance while optimizing memory performance.
Ingenious design and easy maintenance
The server adopts a modular design and supports pull-out maintenance of independent nodes. Various components, such as fans, power supplies, and OCP cards, support hot-swappable maintenance to realize tool-free unpacking and simplify server maintenance.
The system supports rapid system status diagnosis, the new load LED on the front panel of the chassis displays the system running status, the system can be configured with Bluetooth LCD display, and the APP displays fault code information.
The APP allows you to view server asset information, view and set management IP addresses, monitor server power consumption, and environment temperature. The BIOS configuration is complete with one click, and supports up to seven scenarios and 17 application modes, greatly improving server configuration and deployment efficiency.
Low-carbon and efficient noise reduction
The system adopts a new dual-rotor fan module to optimize the fan airfoil structure, significantly improve the superposition effect of fan module wind pressure and air volume, reduce noise, and provide customers with efficient cooling solutions with a new generation of EVAC radiators.
Unique partition intelligent control technology of the whole system, according to the power consumption of components in different air ducts, intelligent adjustment of fan speed, eliminate temperature transmission delay, achieve energy-saving speed regulation and accurate air supply, improve heat dissipation efficiency.
This server uses innovative fan noise reduction materials, these materials are obtained after hundreds of thousands of times of noise reduction materials experimental research, with the characteristics of efficient sound absorption, committed to producing less noise server products for customers.
We follow the concept of sustainable environmental protection, the key components of our products are lead free requirements (RoHS), and all packaging materials are recyclable.
Specifications
| Item | Description |
| Form Factor | 6U rack server |
| Processor | 4/8 x 4th Gen Intel® Xeon® Scalable processors Up to 480 cores 4 UPI links per CPU at up to 16GT/s per link Up to 350W TDP |
| Chipset | Intel C741 |
| Memory | Up to 128 DDR5 RDIMMs with 4,800MT/s at 1DPC and 4,400MT/s at 2 DPC 16 DIMMs per CPU and 128 DIMMs for 8 CPUs RDIMMs/3DS RDIMMs supported |
| Storage | Front: Up to 24 × 2.5-inch SAS/SATA/NVMe drives |
Internal: ICM supports 2 SATA/NVME M.2 SSDs Up to 3 TF cards (PCH ×1 or 2/BMC ×1) | |
| Storage Controller | 2 × SAS/RAID/Trimode cards |
| Network | Up to 4 hot-swap PCIe 5.0 x16 SFF OCP 3.0 cards; compatible with multi-host NIC in the OCP form; NCSI supported |
| I/O Expansion Slot | 16 × FHHL PCIe 5.0 x16 cards/8 × FHHL PCIe 5.0 x16 cards + 4 × dual-width GPUs/8 × single-width GPUs |
| Port | Front: 1 × USB 2.0 port/LCD port, 1 × USB 3.0 port, and 1 × DB15 VGA port Rear: 2 × USB 3.0 ports, 1 × DB15 VGA port, 1 × COM port (Micro USB), and 1 × RJ45 management network port |
| Fan | 8 hot-swap dual-rotor fans with N+1 redundancy |
| Power Supply | 4 × standard CRPS Platinum/Titanium PSU with the output power of 1,300W/1,600W/2,000W/2,700W; N+M redundancy, M≤N |
| System Management | Supports IPMI, SNMP, Redfish, and mobile terminal access management provided by an external Bluetooth LCD display |
| Security Feature | TPM 2.0, BMC/BIOS redundancy, dynamic power-capping, Intel PFR secure boot, and firmware tamper-proofing |
| Operating System | Microsoft Windows Server, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, etc. |
| Dimensions (W × H × D) | 482mm × 263.2mm × 870mm (with mounting ears) 448mm × 263.2mm × 820mm (without mounting ears) |
| Weight | Full configuration: ≤97kg (For details, refer to the White Paper.) |
| Operating Temperature | 5°C to 45°C (For details, refer to the White Paper.) |
Resources
At the same time to provide CDMO services for many domestic and foreign research and development institutions and pharmaceutical companies, has successfully completed more than 50 new drug research and development pipeline of key raw materials production scaling tasks.
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